In Episode 20 of The Downtime, WTWH Media’s weekly manufacturing podcast, co-hosts Sarah Wynn and Sheri Kasprzak talk with Jonathan Mitchell, senior applications engineer at Emerson.
Mitchell shares insights into Emerson’s Floor-to-Cloud approach, predictive maintenance, energy efficiency, and planned demonstrations for Pack Expo Las Vegas.
Connecting packaging line operations to cloud-based analytics
Emerson’s Floor-to-Cloud approach is a digital automation system that connects manufacturing operations on the packaging line directly to cloud-based systems, from individual sensors and devices up to higher-level systems that enable data-driven decision making. It encompasses sensors, actuators, valves, controllers, edge computing devices, plant-wide systems, and cloud-based analytics.
“Most manufacturers are present in maybe one or two parts of a factory, right? Emerson has spent the past several years developing and aligning its portfolio so that we are present across the entirety of most facilities,” explained Mitchell.
By collecting data at each level, the system processes it to provide actionable insights for OEM machine builders, integrators, and plant operators to monitor equipment performance, predict maintenance needs, optimize energy efficiency, and ultimately, make more informed operational decisions.
Mitchell also shared how Emerson combines airflow sensors with valve manifold data to create baseline “guardrails” for compressed air usage. For example, if a valve drifts outside those limits, he said that operators can get a human-machine-interface (HMI) alert prompting preventive maintenance before a bigger problem develops.
Flexible solutions for OEMs
Mitchell also described how Emerson’s modular actuators and control systems help OEMs adapt packaging lines quickly, allowing changes with easy retooling.
“It makes it possible to take an existing system and add or change one of the actuators in a set of actuators to get slightly different motion, so you can adopt a new design without having to scrap everything on your packaging line,” said Mitchell.
He added that compressed air management is another key to packaging efficiency, since air compressors can account for nearly a third of a factory’s energy usage. Lowering line pressure during idle times, he said, can reduce waste without compromising performance when systems restart.
See the tech in action
On the topic of Pack Expo Las Vegas, Mitchell previewed Emerson’s demonstrations, which include:
· Control Tower: Uses a Mobicon SCADA system to pull data from booth demos and displays that information on Emerson’s global dashboard.
· Leak Detection Demo: To highlight packaging integrity, this demo includes a Rosemount sensor and human-machine interface (HMI) connection for modified atmosphere packaging.
· Clean-in-Place (CIP): Showcases Mobicon software and features 290 angle-body valves for food and beverage packaging.
Emerson will also display a plug-and-play bowl feeder, an automated ballpoint pen assembly line, and an electric pick-and-place system. The company says these demos illustrate its modular offerings and Floor-to-Cloud integration.
Mitchell also shared that he’ll be speaking at the event on Emerson’s innovation stage.
“You can come by and hear me wax on about compressed air management, and you might learn the history of compressed air in an industrial setting,” said Mitchell. “Spoiler alert, it’s like 400 years old.”
Follow Packaging OEM for more Pack Expo previews and on-the-ground coverage from Las Vegas.
Episode 20 | Show notes & time stamps
00:17 – The co-hosts start the show
00:49 – The co-hosts talk pumpkin spice, fall vibes
01:20 – Kasprzak shares a Plant Engineering story on how to accelerate predictive maintenance strategies with advanced analytics
02:52 – Wynn talks about Pack Expo, including Somic Packaging’s 434 SuperFlex case packer, which will make its debut in Las Vegas
03:30 – Wynn urges readers to check out Packaging OEM’s eBook on energy efficiency in packaging machines
04:21 – Wynn highlights that Pack Expo preview content is coming to The Downtime, including interviews with JLS Automation and Hoosier Feeder
04:45 – The co-hosts introduce today’s interview guest, Jonathan Mitchell, senior applications engineer at Emerson
05:57 – Interview with Emerson’s Johnathan Mitchell starts
07:28 – Emerson’s Floor-to-Cloud approach
09:41 – Emerson’s presence in packaging applications
10:25 – Mitchell breaks down Emerson’s analysis on predictive maintenance
13:18 – Mitchell explains how consumers are driving packaging sustainability trends
19:33 – Mitchell dives into modularity in factory automation
21:05 – Mitchell reflects on his journey to becoming an engineer
22:11 – Mitchell covers key insights on air compressors
33:30 – Mitchell highlights what Emerson will demo at Pack Expo Las Vegas
34:01 – Mitchell interview ends
34:12 – Game time segment: “Finish the phrase” starts
44:04 – The dynamic duo wraps up the show
About The Downtime podcast and co-hosts
The Downtime is a weekly manufacturing podcast from WTWH Media that features insights from its automation and controls publications. It’s co-hosted by Wynn, who serves as the senior editor (digital) for Packaging OEM, and Kasprzak, who is the managing editor for Plant Engineering, Control Engineering, and Consulting-Specifying Engineer.
Check out The Downtime’s recent episodes
Episode 14: Energy-efficient contactor and secure I/O for packaging lines
Episode 15: Exploring servo motors and robotic grippers in packaging with LinMot
Episode 17: How Neugart gearboxes support packaging machinery
Episode 18: Memphis Record Pressing enhances vinyl packaging with OEM tech
Episode 19: An interview with WTWH Media and Design World journalist Mike Santora
